Advanced Microelectronics Packaging

As the bridge between micro/nanoelectronic devices and various multi-functional systems, micro/nanoelectronic system integration and packaging control more than 90% of the size, 60% of the cost, and a substantial portion of system performance and reliability. Inherently multi-disciplinary, microelectronics packaging is one of the most fascinating and rapidly-developing aspects of semiconductor technology and business, playing a dominant role in the development of future micro/nanoelectronics.

1. Introduction to micro/nanoelectronics packaging

• Basics and state of the art of advanced front-end and back-end technologies

• International roadmaps and strategic research agenda

• Major application trends

2. Levels of packaging

3. Interconnect technologies

4. MEMS and sensor packaging

5. Heterogeneous integration

6. Application-specific packaging (integrated circuits, antenna-in-package, microLEDs, power electronics)

Assessment is based on mini-research projects, conducted preferably in teams. The projects are proposed by the instructors, and can also be proposed in agreement with the instructors by the students based on the content of the course or personal interests.

In case of an insufficient final result, repair options may exist in accordance with Article 17A, Times and number of examinations, sub 1, of the Teaching and Examination Regulations.

Disclaimer: information may change depending on unforeseen circumstances or measures (see: TER Art 2, sub 5).