Advanced Microelectronics Packaging

As the bridge between micro/nanoelectronic devices and various multi-functional systems, micro/nanoelectronic system integration and packaging control more than 90% of the size, 60% of the cost, and a substantial portion of system performance and reliability. Inherently multi-disciplinary, microelectronics packaging is one of the most fascinating and rapidly-developing aspects of semiconductor technology and business, playing a dominant role in the development of future micro/nanoelectronics.

1. Introduction to micro/nanoelectronics packaging

• Basics and state of the art of advanced front-end and back-end technologies

• International roadmaps and strategic research agenda

• Major application trends

2. Levels of packaging

3. Interconnect technologies

4. MEMS and sensor packaging

5. Heterogeneous integration

6. Application-specific packaging (integrated circuits, antenna-in-package, microLEDs, power electronics)